T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion

Product Details
Customization: Available
Type: Copper Foam Sheet
Application: Heat Diffusion, Dissipation and Exchange Materials
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Manufacturer/Factory & Trading Company
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Number of Employees
159
Year of Establishment
2003-07-10
  • T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
  • T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
  • T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
  • T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
  • T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
  • T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
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Basic Info.

Model NO.
20ppi, 0.3G/Cm3
Shape
Square
Alloy
Non-alloy
Color
Red
Standard
GB/T
Products Application
Electromagnetic Shielding Materials.
Characteristic
Great Function of Conducting Heat and Electricity
Transport Package
Wooden Box
Trademark
HGP
Origin
Wuzhou City, Guangxi
HS Code
7409190000
Production Capacity
1200000m2/Year

Product Description

Copper foam

Description:
1 Copper foam has great function of conducting heat and electricity, which can be used as the electrode substrate of lithium ion battery or fuel cell or Nickel zinc battery and electric double layer capacitor electrode material.
2 The copper foam can be also used as Heat sink materials, heat absorption materials, chemical catalyst carrier, electromagnetic shielding materials, filtration materials, damping materials, battery electrode materials, deadening, high-grade decorative materials.
 
Specification
Material Pore(ppi) Density(g/cm3) Thickness(mm) Dimension(mm) Porosity Purity
Copper foam 20-25 0.3 13.0-15.0 610×305mm ≥95% > 99%
T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion

T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion
T13-15mm, Porous Metal Copper Foam for Electronic Heat Diffusion


Packaging & Shipping:
Standard export wooden package or according to customers' requirement.

Product Application:
1.Heat diffusion, dissipation and exchange materials for electronic components such as CPU, display card and LED etc.
2.Electrode material for batteries, such as lithium ion battery, fuel cell, nickel-zinc battery, etc.
3.Electromagnetic shielding materials.
4.Catalyst and its carrier material.
5.Various initial-efficiency, intermediate-effeciency and sub-micron filtration material .
6.Decoration materials for construction.
FAQ
1.Moq:10m²
2.Delivery time:30days after confirm order
3.Payment term:T/T 30%  deposit in advance,70% balance before shipment date.

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