Customization: | Available |
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Type: | Copper Metal Foam |
Application: | Dissipation for Electronic Components |
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Specification | |||||||
Material | Pore(ppi) | Density(g/cm3) | Thickness(mm) | width(mm) | Porosity | Purity | Though Hole Rate |
Copper foam | 130 | 0.3 | 2.0 | 240mm | ≥95% | > 99% | ≥98% |